FIBERPRO’s FA6000 series Auto-Alignment / Bonding system performs ultra-precise and high speed alignment in PLC chip based component manufacturing. FA6000 is designed with unique algorithm, which gives outstanding performance against competitors’. Moreover, the user-friendly features make it easy to learn and operate.

PLC Chip(Splitter, AWG) test / Epoxy Bonding )
Best Productivity
Highest Accuracy
High System Repeatability
High speed Automatic Alignment / Positioning
Automatic Process of Epoxy Dispensing and UV curing